Custom White Oil HDI PCB Board for Vehicle Infotainment &Navigation System

White Oil High Density Interconnect Board for Car Electronics:

A Custom HDI White Oil Automotive PCB is a high‑performance automotive circuit board that combines HDI technology with a white solder mask. HDI enables high‑density interconnections, fine lines, and microvias, allowing miniaturization and reliable high‑speed signal transmission in limited spaces. The white solder mask provides excellent light reflection—critical for LED lighting applications—and enhances the visibility of silkscreen labels. Built to meet strict automotive standards, it withstands extreme temperatures, vibration, and humidity, making it ideal for automotive LED modules, sensors, and compact control systems requiring both performance and durability.

Basic Features:

• HDI Technology: Utilizes microvias, blind/buried vias, and fine-pitch traces for high component density and compact design.
• White Solder Mask: Features a white protective coating that offers superior light reflection and high contrast for clear silkscreen printing.
• Automotive Grade: Manufactured with high TG materials and compliant with IATF 16949 standards, ensuring durability in harsh environments.
• Enhanced Reliability: Delivers stable electrical performance, excellent thermal conductivity, and resistance to high temperatures, vibration, and humidity.

Production Process:

1.Design and Engineering Preparation
The client provides design files (such as Gerber files), and the engineering team conducts Design for Manufacturability (DFM) analysis, optimizing the layout to ensure microvia and trace accuracy, while selecting appropriate substrate materials (such as FR-4 or high-frequency laminates).
2.Inner Layer Fabrication and Drilling
Fabricating inner-layer circuits on the substrate: Copper layers are etched to form circuits via photolithography, followed by laser drilling (or mechanical drilling) to create microvias (typically with diameters less than 0.15mm) for high-density interconnections.
3.Pore metallization and lamination
Chemically plate the holes with copper or fill them with conductive materials to make the hole walls conductive; then laminate all inner and outer layers together under high temperature and pressure to ensure precise alignment of each layer.
4.Outer Layer Manufacturing and Surface Treatment
Add outer layer circuit: After graphic transfer and etching, perform surface treatment (such as gold immersion, OSP, or silver immersion) to enhance solderability and oxidation resistance.
5.Testing and Final Processing
Conduct rigorous circuit function testing (including AOI and electrical testing), confirm defect-free results, then proceed with trimming, cleaning, and packaging for shipment.

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