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K3412 High-Efficiency 3D AOI Machine for Solder Joint and Device Inspection

Categories 3D AOI Machine
Brand Name: MENTO
Model Number: K3412
Certification: FCC.ROHS,CCC
Place of Origin: DONGGUAN
MOQ: 1
Supply Ability: 1000PCS/M
Delivery Time: 30work days
Packaging Details: W1000mmxD1380mmxH1600mm(without foot 100±20mm)
Pcb Size: Max. 500mm x 500mm
Inspection Type: Automated
Light Source: LED
Inspection Speed: 1000mm/s
Camera System: 3D Digital Camera
Resolution: 10μm
Lighting System: LED
Alignment Method: Automatic Alignment
Lighting: RGB LED
Inspection Accuracy: ±5μm
Power Supply: AC 220V, 50/60Hz
Aoi: Automated
Operating System: Windows 10
Dimension: 1000mm x 800mm x 1500mm
Inspection Area: Up To 510 X 510 Mm
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K3412 High-Efficiency 3D AOI Machine for Solder Joint and Device Inspection

Application scope

Solder joint and mounted device inspection


Features

1.High speed, single FOV processing time is about 350ms

2.Anti-interference, high precision, large range

3.RGB light source seamlessly integrates 2D information to enhance judgment accuracy

4.Three-dimensional height visualization, which can display three-dimensional RGB data and height heat maps


Technical parameter

Device modelK3412
Detection capacityDetection itemsMiss print, over solder, insufficient solder, solder bridging, solder paste tailing, shape anomany, offset
Scanning methodStop&Go
Optical systemCamera12MP high-speed color industrial camera
Light Source4 DLP light source (raster phase shift technology) and red, green and blue (RGB) light source
Resolution10μm & 15um (optional)
Detection performanceHeight accuracy (calibration module)1μm (using standard calibration block)
Volume repeatability<1% (standard verification block, 3Sigma)
Maximum Plate Bending Compensation Value±3mm
Detection Capability GRR<10%at6o(+50%tolerance, 5μm resolution)
Maximum detection height20mm/40mm
Solution to shadow problemGrating phase shifting technology to eliminate shadows & four-directional 3D light source illumination system
Plate bending real-time compensation methodPlate Bend Compensation (Z-Tracking+Pad Referencing)
Test screenColor (3D and 2D images displayed together)
Driving equipmentServomotor+Screw Guide
Moving speed800mm/s
Minimum measurable product size50mmx50mm
Maximum product measurable size400mmx500mm
PCB thickness0.5~6mm
Track width adjustmentAutomatic width adjustment, manual width adjustment
Circuit board conveying/fixingBelt conveyor/pneumatic clamp fixing
Conveying directionFrom left to right, right to left
Orbital height900±20mm
Computer ConfigurationMainframeCPU: Intel i5, RAM: DDR4-16G, GPU: GTX1660-6GB, SSD:250G, HDD: 2T
Monitor22"LED
Operating systemUbuntu
ParametersOverall sizeW1000xD1380xH1600mm (excluding alarm light)
Weight1100KG
Power sourceAC220V/50~60Hz/2000W
Air Pressure0.5Mpa
Software Supported Input FormatsSupport Gerber format (274X), ODB++
Environmental requirementsTemperature: 5~40℃, relative humidity: 25%~80% (no frost)
Upstream and downstream equipment communicationStandard SMEMA interface

Quality K3412 High-Efficiency 3D AOI Machine for Solder Joint and Device Inspection for sale
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