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Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352

Categories Aviation Parts
MOQ: 1 pcs
Payment Terms: L/C, T/T
Delivery Time: 12-14weeks
Packaging Details: boxes
Brand Name: Xilinx
Model Number: XQV300-4BG352N
Place of Origin: USA
Price: Negotiable
Package: PLASTIC, BGA-352
Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
Combinatorial Delay of a CLB-Max: 0.8 ns
JESD-30 Code: S-PBGA-B352
Operating Temperature-Min: -55.0 Cel
Supply Voltage-Nom: 2.5 V
Supply Voltage-Max: 2.625 V
Technology: CMOS
Terminal Finish: Tin/Lead (Sn63Pb37)
Time@Peak Reflow Temperature-Max (s): 30
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Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352

Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352


Descriptions of Aviation Parts :


The QProTM VirtexTM FPGA family delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 0.22 µm CMOS process. These advances make QPro Virtex FPGAs powerful and flexible alternatives to mask-programmed gate arrays. The Virtex family comprises the four members shown in Table 1. Building on experience gained from previous generations of FPGAs, the Virtex family represents a revolutionary step forward in programmable logic design. Combining a wide variety of programmable system features, a rich hierarchy of fast, flexible interconnect resources, and advanced process technology, the QPro Virtex family delivers a high-speed and high-capacity programmable logic solution that enhances design flexibility while reducing time-to-market. Refer to the "VirtexTM 2.5V Field Programmable Gate Arrays" commercial data sheet for more information on device architecture and timing specifications.


Features of Aviation Parts:


Certified to MIL-PRF-38535 (Qualified Manufacturer Listing) Guaranteed over the full military temperature range to +125°C) Ceramic and Plastic Packages Fast, high-density Field-Programmable Gate Arrays Densities from to 1M system gates System performance to 200 MHz Hot-swappable for Compact PCI 16 high-performance interface standards Connects directly to ZBTRAM devices Four dedicated delay-locked loops (DLLs) for advanced clock control Four primary low-skew global clock distribution nets, plus 24 secondary global nets LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit Shift Register Configurable synchronous dual-ported 4K-bit RAMs Fast interfaces to external high-performance RAMs Dedicated carry logic for high-speed arithmetic Dedicated multiplier support Cascade chain for wide-input functions Abundant registers/latches with clock enable, and dual synchronous/asynchronous set and reset Internal 3-state bussing IEEE 1149.1 boundary-scan logic Die-temperature sensing device


Specification of Aviation Parts :


Mfr Package Description

PLASTIC, BGA-352

REACH CompliantYes
StatusDiscontinued
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Combinatorial Delay of a CLB-Max0.8 ns
JESD-30 CodeS-PBGA-B352
JESD-609 Codee0
Moisture Sensitivity Level3
Number of CLBs1536.0
Number of Equivalent Gates322970.0
Number of Inputs260.0
Number of Logic Cells6912.0
Number of Outputs260.0
Number of Terminals352
Operating Temperature-Min-55.0 Cel
Operating Temperature-Max125.0 Cel
Organization1536 CLBS, 322970 GATES
Package Body MaterialPLASTIC/EPOXY
Package CodeLBGA
Package Equivalence CodeBGA352,26X26,50
Package ShapeSQUARE
Package StyleGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)225
Power Supplies1.2/3.6,2.5
Qualification StatusNot Qualified
Screening Level38535Q/M;38534H;883B
Seated Height-Max1.7 mm
Sub CategoryField Programmable Gate Arrays
Supply Voltage-Nom2.5 V
Supply Voltage-Min2.375 V
Supply Voltage-Max2.625 V
Surface MountYES
TechnologyCMOS
Temperature GradeMILITARY
Terminal FinishTin/Lead (Sn63Pb37)
Terminal FormBALL
Terminal Pitch1.27 mm
Terminal PositionBOTTOM
Time@Peak Reflow Temperature-Max (s)30
Length35.0 mm
Width35.0 mm

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