Categories | 4 Layer PCB Board |
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Brand Name: | Global Success Circuits Co.,Ltd |
Model Number: | GPC12580 |
Certification: | ISO 9001-2008, ISO TS 16949 ,UL |
Place of Origin: | China (mainland) |
MOQ: | 1 Piece |
Price: | US$ 0.3 - 1.3 / Piece |
Payment Terms: | L/C, D/P, T/T, Western Union |
Delivery Time: | 1 - 15 days |
Packaging Details: | vacuum package |
Material: | FR4 |
Board thickness: | 1.6MM |
Soldermask: | Green |
Silkscreen: | White |
Surface treatment: | LF HASL |
Copper thickness: | 2OZ |
Min. grid line width: | 4MIL |
Minimum line width/space: | 3.5MIL |
Impedance control tolerance: | +/-8% |
High TG: | tg175 |
Company Info. |
Global Success Circuits Co.,Ltd |
View Contact Details |
Product List |
2 Layer High Temperature PCB Silkscreen Electronical Printed Circuit Board 1.6Mm
Number of layers: 2 layers
Material: FR4
Board thickness: 1.6mm
Surface plating: Lead Free HASL
Special process description: 3OZ
TG Value: TG175
Our goal is long term relationships developed through customer service excellence and our commitment to consistent delivery of high quality, competitively priced products. We recognize that our most valuable asset is our customer—we work for you.
Please feel free to send RFQ’s to gauge our competitiveness without obligation. We welcome the opportunity to be of service.
PCBA/PCB assembly specifications:
What can we do for you?
For PCBA order, provide us:
Services and applications:
PCBA capabilities:
Competitive advantages:
Item | Mass production | Small batch production | ||
Number of layers | UP TO 18L | UP TO L | ||
Laminate type | FR-4, halogen free, high TG(Shengyi, KB), Cem-3, PTFE, aluminum based, PTEE, Rogers or more. | FR-4, Halogen free, High TG(Shengyi, KB), Cem-3, PTFE, Aluminum based, PTEE, Rogers or more. | ||
Maximum board size | 610mm*1100mm | 610mm*1100mm | ||
Board thickness | 0.1mm-7.00mm | <0.1mm and >7.00mm | ||
Minimum line width/space | 3.5mil(0.0875mm) | 3mil(0.075mm) | ||
Minimum line gap | +/-15% | +/-10% | ||
Outer layer copper thickness | 35um-175um | 35um-210um | ||
Inner layer copper thickness | 12um-175um | 12um-210um | ||
Drilling hole size(Mechanical) | 0.15mm-6.5mm | 0.15mm-6.5mm | ||
Finished hole size (Mechanical) | 0.15mm-6.0mm | 0.15mm-6.0mm | ||
Board thickness hole size ratio | 14:1 | 16:1 | ||
Board thickness tolerance(t=0.8mm) | ±8% | ±5% | ||
Board thickness tolerance(t<0.8mm) | ±10% | ±8% | ||
Min. grid line width | 4mil(12, 18, 35um), 6mil(70um) | 4mil(12, 18, 35um), 6mil(70um) | ||
Min. grid spacing | 6mil(12, 18, 35um), 8mil(70um) | 6mil(12, 18, 35um), 8mil(70um) | ||
Hole size tolerance(Mechanical) | 0.05-0.075mm | 0.05mm | ||
Hole position tolerance(Mechanical) | 0.005mm | 0.005mm | ||
Solder mask color | Green, Blue, Black, White, Yellow, Red, Grey etc. | Green, Blue, Black, White, Yellow, Red, Grey etc. | ||
Impedance control tolerance | +/-10% | +/-8% | ||
Min. distance between drilling to conductor(non-blind buried orifice) | 8mil(8L), 9mil(10L), 10mil(14L), 12mil(26L) | 6mil(8L), 7mil(10L), 8mil(14L), 12mil(26L) | ||
Min. Character width and height(35um base copper) | Line width: 5mil Height: 27mil | Line width: 5mil; height: 27mil | ||
Max. test voltage | 500V | 500V | ||
Max. test current | 200mA | 200mA | ||
Surface treatment | Flash Gold | 0.025-0.075um | 0.025-0.5um | |
Immersion Gold | 0.05-0.1um | 0.1-0.2um | ||
Sn/Pb HASL | 1-70um | 1-70um | ||
Lead-free HASL | 1-70um | 1-70um | ||
Immersion Silver | 0.08-0.3um | 0.08-0.3um | ||
OSP | 0.2-0.4um | 0.2-0.4um | ||
Gold Finger | 0.375um | >=1.75um | ||
Hard Gold Plating | 0.375um | >=1.75um | ||
Immersion Sin | 0.8um | |||
V-Cut rest thickness tolerance | ±0.1mm | ±0.1mm | ||
Outline profile | Chamfer | The angle type of the chamfer | 30,45,60 | |
Plug via hole | Max.size can be plugged | 0.6mm | ||
Largest NPTH hole size | 6.5mm | >6.5mm | ||
Largest PTH hole size | 6.5mm | >6.5mm | ||
Min. solder spacer ring | 0.05mm | 0.05mm | ||
Min. solder bridge width | 0.1mm | 0.1mm | ||
Drilling diameter | 0.15mm-0.6mm | 0.15mm-0.6mm | ||
Min. pad diameter with hole | 14mil( 0.15mm drilling) | 12mil( 0.1mm laser) | ||
Min. BGA pad diameter | 10mil | 8mil | ||
Chemical ENIG gold thickness | 0.025-0.1um(1-4U) | 0.025-0.1um | ||
Chemical ENIG nickel thickness | 3-5um(120-200U) | 3-5um | ||
Min. resistance test | Ω | 5 |