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2 Layer High Temperature PCB Silkscreen Electronical Printed Circuit Board 1.6Mm

Categories 4 Layer PCB Board
Brand Name: Global Success Circuits Co.,Ltd
Model Number: GPC12580
Certification: ISO 9001-2008, ISO TS 16949 ,UL
Place of Origin: China (mainland)
MOQ: 1 Piece
Price: US$ 0.3 - 1.3 / Piece
Payment Terms: L/C, D/P, T/T, Western Union
Delivery Time: 1 - 15 days
Packaging Details: vacuum package
Material: FR4
Board thickness: 1.6MM
Soldermask: Green
Silkscreen: White
Surface treatment: LF HASL
Copper thickness: 2OZ
Min. grid line width: 4MIL
Minimum line width/space: 3.5MIL
Impedance control tolerance: +/-8%
High TG: tg175
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    2 Layer High Temperature PCB Silkscreen Electronical Printed Circuit Board 1.6Mm

    2 Layer High Temperature PCB Silkscreen Electronical Printed Circuit Board 1.6Mm


    Number of layers: 2 layers
    Material: FR4
    Board thickness: 1.6mm
    Surface plating: Lead Free HASL
    Special process description: 3OZ

    TG Value: TG175


    Our goal is long term relationships developed through customer service excellence and our commitment to consistent delivery of high quality, competitively priced products. We recognize that our most valuable asset is our customer—we work for you.

    Please feel free to send RFQ’s to gauge our competitiveness without obligation. We welcome the opportunity to be of service.


    PCBA/PCB assembly specifications:

    1. PCB layers: 1 to 18 layers (standard)
    2. PCB materials/types: FR4, aluminum, CEM1, super thin PCB, FPC/gold finger, HDI
    3. Assembly service types: DIP/SMT or mixed SMT and DIP
    4. Copper thickness: 0.5-10oz
    5. Assembly surface finish: HASL, ENIG, OSP, immersion tin, immersion Ag, flash gold
    6. PCB dimensions: 450x1500mm
    7. IC pitch (min): 0.2mm
    8. Chip size (min): 0201
    9. Leg distance (min): 0.3mm
    10. BGA sizes: 8x6/55x55mm
    11. SMT efficiency: SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
    12. u-BGA ball diameter: 0.2mm
    13. Required docs for PCBA Gerber file with BOM list and pick-n-place file (XYRS)
    14. SMT speed: chip components SMT speed 0.3S/pieces, max speed 0.16S/pieces

    What can we do for you?

    1. EMS-electronic manufacturing service
    2. PCB supply and layout
    3. PCB assembly on SMT, BGA and DIP
    4. Cost effective components sourcing
    5. Fast turn prototype and mass production
    6. Box build assembly
    7. Engineering supported
    8. Tests (X-ray, 3D paste thickness, ICT, AOI and functional tests)

    For PCBA order, provide us:

    1. PCB Gerber file
    2. BOM list for PCBA
    3. Sample of PCB and PCBA
    4. Test method for PCBA

    Services and applications:

    1. Through hole board assembly
    2. SMT assembly including BGA assembly, smallest placement: 0201
    3. Material procurement
    4. Consigned material management
    5. Plastic or metal enclosure
    6. Complex final assembly
    7. Functional test
    8. Cable assembly
    9. Labeling and packing
    10. Customized logistics per customer
    11. Laser cut framed SMT solder paste stencils
    12. PCB design and schematic capture

    PCBA capabilities:

    1. Component height: 0.2-25mm
    2. Min packing: 0201
    3. Min distance from
    4. BGA: 0.25-2.0mm
    5. Min BGA size: 0.1-0.63mm
    6. Min QFP space: 0.35mm
    7. Min assembly size: 50*30mm
    8. Max assembly size: 350*550mm
    9. Pick-placement precision: 0.01mm
    10. Pick-placement range: QFP, SOP, PLCC, BGA
    11. Placement capability: 0805, 0603, 0402, 0201
    12. High-pin count press fit available
    13. SMT capacity per day: 3,200,000 point

    Competitive advantages:

    1. No minimum order quantity and free sample
    2. Focus on low to medium volume production
    3. Quick and on-time delivery
    4. International approvals
    5. Great customer service
    6. Diversified shipping method

    ItemMass productionSmall batch production
    Number of layersUP TO 18LUP TO L
    Laminate typeFR-4, halogen free, high TG(Shengyi, KB), Cem-3, PTFE, aluminum based, PTEE, Rogers or more.FR-4, Halogen free, High TG(Shengyi, KB), Cem-3, PTFE, Aluminum based, PTEE, Rogers or more.
    Maximum board size610mm*1100mm610mm*1100mm
    Board thickness0.1mm-7.00mm<0.1mm and >7.00mm
    Minimum line width/space3.5mil(0.0875mm)3mil(0.075mm)
    Minimum line gap+/-15%+/-10%
    Outer layer copper thickness35um-175um35um-210um
    Inner layer copper thickness12um-175um12um-210um
    Drilling hole size(Mechanical)0.15mm-6.5mm0.15mm-6.5mm
    Finished hole size (Mechanical)0.15mm-6.0mm0.15mm-6.0mm
    Board thickness hole size ratio14:116:1
    Board thickness tolerance(t=0.8mm)±8%±5%
    Board thickness tolerance(t<0.8mm)±10%±8%
    Min. grid line width4mil(12, 18, 35um), 6mil(70um)4mil(12, 18, 35um), 6mil(70um)
    Min. grid spacing6mil(12, 18, 35um), 8mil(70um)6mil(12, 18, 35um), 8mil(70um)
    Hole size tolerance(Mechanical)0.05-0.075mm0.05mm
    Hole position tolerance(Mechanical)0.005mm0.005mm
    Solder mask colorGreen, Blue, Black, White, Yellow, Red, Grey etc.Green, Blue, Black, White, Yellow, Red, Grey etc.
    Impedance control tolerance+/-10%+/-8%
    Min. distance between drilling to conductor(non-blind buried orifice)8mil(8L), 9mil(10L), 10mil(14L), 12mil(26L)6mil(8L), 7mil(10L), 8mil(14L), 12mil(26L)
    Min. Character width and height(35um base copper)Line width: 5mil
    Height: 27mil
    Line width: 5mil; height: 27mil
    Max. test voltage500V500V
    Max. test current200mA200mA




    Surface treatment
    Flash Gold0.025-0.075um0.025-0.5um
    Immersion Gold0.05-0.1um0.1-0.2um
    Sn/Pb HASL1-70um1-70um
    Lead-free HASL1-70um1-70um
    Immersion Silver0.08-0.3um0.08-0.3um
    OSP0.2-0.4um0.2-0.4um
    Gold Finger0.375um>=1.75um
    Hard Gold Plating0.375um>=1.75um
    Immersion Sin0.8um
    V-Cut rest thickness tolerance±0.1mm±0.1mm








    Outline profile
    ChamferThe angle type of the chamfer30,45,60
    Plug via holeMax.size can be plugged0.6mm
    Largest NPTH hole size6.5mm>6.5mm
    Largest PTH hole size6.5mm>6.5mm
    Min. solder spacer ring0.05mm0.05mm
    Min. solder bridge width0.1mm0.1mm
    Drilling diameter0.15mm-0.6mm0.15mm-0.6mm
    Min. pad diameter with hole14mil( 0.15mm drilling)12mil( 0.1mm laser)
    Min. BGA pad diameter10mil8mil
    Chemical ENIG gold thickness0.025-0.1um(1-4U)0.025-0.1um
    Chemical ENIG nickel thickness3-5um(120-200U)3-5um
    Min. resistance testΩ5

    Product Tags:

    4 layer board

      

    4 layer pcb prototype

      
    Quality 2 Layer High Temperature PCB Silkscreen Electronical Printed Circuit Board 1.6Mm for sale
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